罗杰斯Corporation will be launching its Radix 3D Printable Dielectrics family of products at the IPC APEX EXPO 2022, January 25th through January 27st, at the San Diego Convention Center in San Diego, CA. The IPC APEX EXPO is a leading event for the printed circuit board and electronics manufacturing and assembly industry, providing a […]
强化，罗杰斯公司（Rogers Corp.
Fortify是一家位于波士顿的3D打印初创公司，以及用于高级连通性和电力电子工程材料的全球领导者Rogers Corporation宣布了合作伙伴关系，以实现对射频（RF）设备（RF）设备和电子设备的低损坏介电材料的加法制造。该合作伙伴关系允许两家公司利用其专业知识领域来解锁[…]的可扩展制造。
汽车雷达传感器应用的具有成本效益的层压板
Rogers Corporation（NYSE：ROG）宣布了其RO4000®系列热固性电路材料的最新成员：RO4830™高频层压板。RO4830层压板提供76至81-GHz自动雷达传感器设计师，一种低成本但绩效竞争的选项。Rogers RO4830层压板的价格较低，并通过标准环氧/玻璃（FR-4）电路制造方法进行处理，以降低基于PTFE的总生产成本…
液体冷却材料，旨在消散大量热量
Rogers Corporation的Power Electronics Solutions（PES）Group推出了其最新的高性能冷却材料Curamik Coolperformance Plus。Curamik Coolperformance Plus是一种高级液冷材料，旨在消散…
APEC 2016上的Advanced Rolinx电容器BUSBAR解决方案
罗杰斯Corporation’s Power Electronics Solutions (PES) group will be showing examples of its latest advances in busbar power management technology at the upcoming APEC 2016 conference and exhibition,…
罗杰斯Corporation to exhibit new materials at IPC APEX Expo
罗杰斯公司(NYSE:罗格)将展出t the upcoming IPC APEX Expo, scheduled for March 15-17 at the Las Vegas Convention Center (Las Vegas, NV). On the conference side, John Coonrod, Technical Marketing Manager for Rogers Advanced Connectivity Solutions, and author of the popular ROG Blog series, will present his paper on “High Frequency RF…
Online support hub keys on thermal management of power designs
罗杰斯Corporation’s (NYSE:ROG) Power Electronics Solutions (PES) group provides some of the world’s leading high-power and thermal management materials solutions with its ROLINX and curamik product lines. To…
罗杰斯公司（Rogers Corporation
罗杰斯Corporation will be at PCB West, one of the electronic industry’s major technical events, on September 16, 2015 at the Santa Clara Convention Center (Santa Clara, CA). Rogers will provide examples of its high-performance printed-circuit-board (PCB) materials and participate in the technical symposium with a talk on how to perform wideband testing of PCBs…
罗杰斯公司（Rogers Corp）的高性能泡沫业务部门将名称更改为弹性材料解决方案
Effective today, the High Performance Foams Division of Rogers Corporation (NYSE: ROG) has officially changed its name to Elastomeric Material Solutions to better reflect the growing range of products and capabilities available to meet customer needs. “This name change is the result of productive input and dialogue with customers and employees from around the world,”…
Ro3000®层压板卷卷纸箔
Rogers Corporation（NYSE：ROG）高级电路材料部最近推出了其RO3003™，RO3035™和RO3203™低介电恒定恒定层压板材料的卷层覆层选项。光滑的滚动铜，与RO3000®PTFE-Ceramic树脂系统的非常低的介电损耗配对，可导致高频电路材料具有一流的插入损失。这些材料是理想的…
罗杰斯Corporation to Exhibit a Range of Performance Silicone Foams
罗杰斯Corporation (NYSE:ROG), represented by its High Performance Foams Division (HPF), will be exhibiting its portfolio of performance silicone materials at the upcoming Aircraft Interiors Expo 2014. Aircraft Interiors Expo 2014 is the leading international event for emerging designs in cabin interiors, in-flight entertainment, connectivity and passenger services, in addition to aircraft design and construction.…
罗杰斯Corporation Recognized as Top CT Tech Company
罗杰斯Corporation (NYSE:ROG) has been named one of the top 40 tech companies in Connecticut by the Marcum Tech Top 40. The annual award, presented by Marcum LLP,…
罗杰斯公司提供物质解决方案
Rogers Corporation（NYSE：ROG）将有代表在PCB West展览（http://pcbwest.com）上讨论电子印刷电池板（PCB）材料解决方案，2013年9月25日在圣克拉拉会议中心在加利福尼亚州圣克拉拉（200号展位）。罗杰斯将突出显示其新的High-DK RO4360G2™层压板和2929键合材料。除了比较不同的电路材料...