罗杰斯公司will be at PCB West, one of the electronic industry’s major technical events, onSeptember 16, 2015在圣克拉拉会议中心(加利福尼亚州圣克拉拉)。罗杰斯(Rogers)将提供其高性能印刷电路板(PCB)材料的示例,并通过有关如何用板表面处理的PCB进行宽带测试,参加技术研讨会。
Rogers’ personnel will be at Booth 200 with examples of high-frequency circuit materials, including Rogers RO4835™, RO4360G2™ and RO3003™ high performance laminates.
Rogers RO4835 high-frequency laminates, specially formulated with enhanced oxidation resistance, were developed for applications needing improved electrical stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. Just as with RO4350B™ material, RO4835 laminates offer a dielectric constant of 3.48 at 10 GHz, a low loss tangent of 0.0037 at 10 GHz, and low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability across a wide range of processing and operating conditions.
These improved oxidation resistant circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard fabrication methods. Typical applications include automotive radar and sensors, point-to-point microwave backhaul units, power amplifiers and phased-array radar.
For designers seeking further circuit miniaturization, Rogers will also be showing its RO4360G2 circuit laminates. These circuit materials have a tailored high Dk of 6.15 @ 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminates’ higher Dk allows for a significant reduction in finished circuit board size (approximately 25-30% in most cases). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B material.
UL 94 v-0火焰评级和完全无铅process capable, RO4360G2 laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B material.
RO3003层压板具有紧密控制的介电常数(10GHz时为3.04 +/- 0.04),并且在温度下(-3 ppm/°C从-50°C到150°C)非常稳定。RO3003 PTFE-Ceramic复合树脂系统可实现非常低的介电损耗(10GHz时为0.0010),并且可以用滚动铜购买层压板,以进一步增强PCB插入损失性能。由于其出色的电气性能,RO3003层压板通常是为77-79GHz汽车雷达传感器和60GHz点对点进行回程应用程序选择的。
作为PCB WEST 2015技术会议的一部分,Rogers的技术营销经理John Coonrod是流行的ROG博客系列的作者,将介绍“多个PCB最终板条饰面的宽带插入损失测试”。参加演示文稿,这是安排F1会议的一部分September 16, 9:00-10:00 AM,所有展览和会议与会者都是免费的。
罗杰斯公司
www.rogerscorp.com
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