Through photos and videos, EE World covers some of the active and passive components that RF and wireless engineers need to connect us all.
The exhibit hall at the 2023 International Microwave Symposium featured connectors from Molex, Samtec, and SV Microwave, among others.
See EE World’s IMS 2023 coverage oftest equipmenton Test & Measurement Tips;semiconductors and componentson 5G Technology World.
| Molex made several announcements just prior to IMS. The company enhanced its224 Gb/sec ecosystem, which includes the Mirror Mezz Enhanced genderless mezzanine board-to-board connectors 224 Gb/sec PAM4 speeds. |
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| In the video at right, EE World’s Sr. Technical Editor Martin Rowe met with Samtec’s Pete Robinson who demonstrated the company’s靶心connector line with up to 90 GHz of bandwidth. The connectors are flush-mounted, attaching to a board with screws. Thus, there’s no soldering needed. Robinson also demonstrated RF connectors with alignment pins to maximize RF performance. By adding fiducials to your board, you can properly align the connector. |
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| SV Microwave exhibited an array of edge launch, solderless edge launch, stripline, and CPW microstrip连接器. Sizes include 1.58 mm, 2.4 mm, 2.92 mm, and SMA. |
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