Rogers Corporation（NYSE:ROG) High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices—Condux Plus™ electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for handheld devices in need of enhanced conductivity and shielding performance.
Condux Plus材料，有几种不同的厚度（0.33,0.53和0.73毫米），可提供一致且可靠的连接，同时还提供出色的机械稳定性随时间和温度。例如，典型的压缩设置为0.021英寸 - 厚（0.53毫米厚）的配置泡沫，仅为2.5％。该材料有助于保持最复杂的移动设备和手持式设计的电气完整性，形成可靠的电连接并提供必要的电导率，无论是未压缩还是完全压缩。
Rogers Condux Plus foam also serves as an excellent EM shielding material, with superb shielding effectiveness (SE) over a wide operating frequency range of 200 MHz to 10 GHz. Condux Plus materials have been tested per IEEE-299 methods to provide a minimum SE of 60 dB, effectively reducing the power of EM fields by more than 99%.
Condux加上导电泡沫是RoHS并达到柔顺，并且不会使加工变形，产生具有模具切割的直边。可以堆叠泡沫以用于填充间隙，同时保持高水平的电导率和屏蔽。
Rogers Corporation
www.rogerscorp.com/hpf
Filed Under:Materials • advanced
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