Engineers at BE CAE & Test (Catania, Italy) have taken the simulation process well beyond the typical approach of “run a test/deliver a report.” Instead, using the COMSOL Multiphysics software and the Application Builder, they have created a series of easy-to-use custom applications for virtual prototyping of customers’ surface-mount device designs. The apps hide the complexity of the underlying detailed model, yet still provide access to the functionality of the simulation.
Thermal management techniques ensure the efficiency of electronic devices, improve reliability, and prevent premature failure. Numerical simulation is an important part of the process, allowing engineers to analyze and optimize temperature and air flow early in the design. BE CAE & Test is creating custom applications to give designers interactive tools to access, analyze and share the vast amount of information available from the mathematical models they created without needing app users to be simulation specialists themselves.
The app created by BE CAE & Test conducts a thermal analysis that lets users evaluate important thermal characteristics. The temperature distribution within the device, maximum temperature reached, junction-to-case thermal resistance as a function of solder thickness, and dissipated power and constitutive material of the solder and the die are among the results presented to the app user.
BE CAE & Test
www.be-caetest.it
COMSOL
www.comsol.com
Filed Under:Rapid prototyping
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