Rogers Corporation (NYSE:ROG) will offer both packaging and thermal management solutions at the 2011 International Microelectronics and Packaging Society (IMAPS) Conference and Exhibition in the Long Beach Convention Center, October 11-13, 2011.
Rogers will be exhibiting high-performance circuit materials as well as thermal management materials at this year’s IMAPS Exhibition.
Visitors can stop by Booth #210 to learn how Rogers materials can help with packaging designs and thermal management. In particular, representatives from Rogers ACMD will highlight the benefits of their Theta® circuit materials, RT/duroid® 6035HTC and ULTRALAM® 3850 high-frequency materials.
For designers of high-power, high-frequency circuits, such as power amplifiers and beam-forming networks, Rogers RT/duroid 6035HTC is the answer. The high-thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear versus some competitive offerings. The thermally stable material has a z-axis dielectric constant of 3.5 at 10 GHz, low loss by virtue of a loss tangent of 0.0013 at 10 GHz, and is available with reverse-treated, electrodeposited copper foil.
罗杰斯ULTRALAM 3850液体-crystal-polymer (LCP) laminates feature low, stable dielectric constant (typically 2.9 at 10 GHz) with tightly controlled thickness uniformity for excellent signal integrity in high-speed circuits. These double-clad laminates exhibit low dissipation factor of 0.0025 at 10 GHz, making them strong candidates for single-layer and multilayer circuits requiring low loss and stable electrical performance.
罗杰斯的无卤θengineere材料d for outstanding mechanical and electrical performance in high-speed digital circuits. With a coefficient of thermal expansion (CTE) of 50 ppm/°C in the z-axis, they have about 30% less expansion, across the same temperature range, than standard FR-4 for improved reliability of plated through holes (PTHs) in multilayer circuits. The low dissipation factor of 0.0118 at 1 GHz ensures that Theta materials preserve signal integrity in the most challenging digital circuit designs. Theta materials feature a dielectric constant of 3.90 at 1 GHz. In addition, these dependable laminates support RoHS-compliant manufacturing processes and meet UL-94-V-0 level flammability requirements.
In addition, members of Rogers TMS Division will also explain the advantages of HEATWAVE™ Metal Matrix Composite (MMC) and COOLSPAN™ Thermal Interface Materials for thermal management in a wide range of electronic circuits. With their exceptional thermal performance and controlled coefficient of thermal expansion (CTE), HEATWAVE materials can dramatically improve the reliability of semiconductor devices and circuits normally subjected to the stress of thermal cycling. By matching the CTE of the mating structures in a circuit or system, such as power modules in electric and hybrid vehicles, can greatly relieve thermal stress. Rogers COOLSPAN Thermal Interface Materials are ideal for high-performance, high-reliability chip packaging applications where thermal management is critical. These non-silicone materials offer outstanding thermal stability, with excellent high-temperature performance and superior rework properties.
Rogers Corporation
www.rogerscorp.com
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Filed Under:Packaging,Materials • advanced
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