钱德勒，亚利桑那州– Rogers Corporation and its Advanced Circuit Materials (ACM) Division earned a distinguished DesignCon Paper Award at last month’s DesignCon 2010 Conference and Exhibition in Santa Clara, CA.
The paper, “Effect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High-Frequency Transmission Lines,” was co-authored by Allen F. Horn III, John Reynolds, and Patricia LaFrance of Rogers Corporation and James Rautio, President of Syracuse, NY-based Sonnet Software. It offers insights and solutions on issues that have long plagued designers of thin printed-circuit boards (PCBs) – issues specifically related to the effects of conductor surface roughness on PCB performance.
该论文着重于导体表面粗糙度及其对导体损耗和有效介电常数的影响。该论文包括许多重要发现，包括证明导体损耗的实际增加可能大大比使用了两个最广泛使用的粗糙度因子校正模型所预测的，并且出乎意料的是会显着影响有效的介电常数。特别是，导体粗糙度可以将薄电路中的有效介电常数增加15％，并增加分散体。
The DesignCon Paper Award is based on the quality, relevance, impact and originality of the written paper as well as the oral presentation. The Rogers’ paper – one of only 10 papers to win a DesignCon Paper Award at the 2010 conference – was selected by the International Engineering Consortium (IEC) and DesignCon 2010 Technical Program Committee as the winner of the “Board and System Design” category. By their selection, award winners are recognized as “leading practitioners in semiconductor and electronic design.”
除技术论文奖外，RogersRo4000®Lopro™层压板在“ PCB设计工具和技术”类别中被任命为DesignCon 2010 DesignVision奖决赛入围者。DesignVision Awards是为了承认电子设计的创新和有远见的产品而颁发的，Rogers是该特定类别中决赛入围者中唯一的电子材料供应商。
Rogers Corporation
www.rogerscorp.com/acm
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Filed Under:半导体,计算机板,Electronics • electrical
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