Overview
随着电子设备的功率密度的上升，对芯片和系统热管理的需求也会上升。冷却组件的一种方法是添加散热器。散热器使用传导，对流和有时辐射来增强从热表面到较冷的流体的热传递。选择散热器时，需要考虑许多因素，例如成本，生产性和重量。如何连接到组件的散热器也至关重要。
During this 45 minute presentation, we will focus on how heatsinks work and how to design a heatsink while considering all the critical factors such as size, airflow, cost and attachment methods. We will also investigate how, using simulation, the heatsink design could be optimized and validated in the application environment. Engineers involved in board and chassis design would find this session very educational.
What You Will Learn
- How to design a heatsink for a specific electronics cooling application
- To visualize the airflow around the heatsink and identify potential bypass areas
- Estimate heatsink thermal resistance
- Use Response Surface Optimization to come up with the best heatsink design for the considered environment
提交以下：3D CADWorld
