德州仪器公司awarded Adam Munich, a freshman from Rochester Institute of Technology, as the overall winner of the Engibous Prize in its sixth annual TI Analog Design Contest. This contest showcases the innovative projects and competitive spirit of today’s future engineers. Munich’s project focused on improving the original Tesla coil, which is used to produce high-voltage, low-current and high-frequency alternating-current electricity. His design used seven TI components in its construction.
Munich’s improved Tesla coil features a 10kVA IGBT H-bridge, which switches at the primary current zero crossing point. Munichput the IGBT’s abilities to the test through this project and ultimately created a large, musical Tesla coil. The H-bridge that was used is a more advanced solution to improving the Tesla coil, and Munich mastered its construction in his project.
During the 2012-13 school year, 47 accredited engineering colleges and universities from the U.S. and Canada participated in the TI Analog Design Contest, which attracted over 450 participants. The annual Engibous Summit, named after former TI chairman and CEO Thomas Engibous, included the top 10 finalist teams which represented seven universities. These top engineering university students presented their projects to a panel of notable TI and guest judges during the three-day event inDallas.
Engibous Prize Top Winners
Cash prizes were awarded to the top three winners: $10,000 for first place, $7,500 for second place, and $5,000 for third. The People’s Choice award winner will receive $1,000.
First Place
- Rochester Institute of Technology
- An improved Tesla coil
- Adam Munich
Second Place
- Michigan State University
- ECG demonstration board
- Justin Bohr; Mike Mock; Nate Kesto; Yuan Mei; Chaoli Ang; Xie He
Third Place
- University of Puerto Rico at Mayaguez
- Easy-tune automatic guitar tuning system
- Javier R. Rivera-Collazo; Eduardo G. Rodriguez-Galindo; Jesus R. Torrado-Diaz
People’s Choice
- University of Texas at Austin
- Food safety device
- Matt Leaverton; Alex Hershey; Ethan Schneider; Jennifer Davis; Omer Neak
The 2014 TI Analog Design Contest, renamed TI Innovation Challenge, will open on September 2, 2013 to eligible contestants in the U.S., Canada and, for the first time, Mexico. Visitwww.ti.com/tiic-nafor more details.
德州仪器公司
www.ti.com
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