TE Connectivity (TE) announces new surface-mount LGA 2011 socket for Intel Corporation’s Core i7 and Xeon 5 CPU processors.
TE新LGA 2011插座的触点包括用于表面安装到印刷电路板（PCB）上的焊球。该产品的六角形阵列提供更强大的住房，并最大限度地减少2011年球占据的空间。插座拥有一个集成的杠杆机构（ILM），它产生Z轴压缩负载，并且其坚固的撑板限制了压缩期间PCB弯曲。
The product is available in either 15u’’ or 30u’’ gold contact plating for enhanced product performance. TE provides a complete socket and hardware system, while the ILM and backer plate must be ordered separately.
TE Connectivity
http://www.te.com/
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Filed Under:Electronics • electrical,Industrial computers
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