GE智能平台(纽约证券交易所:GE)宣布该公司增长范围的COM Express模块的最新补充是推出其最高绩效产品,迄今为止,坚固的BCOM6-L1400。利用最近宣布的英特尔®酷睿™I7处理器的重要加工和图形功能,BCOM6-L1400可以在广泛的嵌入式计算中支持各种商业,工业,运输和防御应用中的多种独立显示器环境。
在一系列公告后,BCOM6-L1400的推出进一步扩展了GE的Rugged COM Express解决方案范围。最近上最近的是推出坚固的BCOM6-L1200 - 这是一系列五维Via Nano™和Eden™处理器选项 - 2月。
通过将承载卡从处理器分离,COM Express架构通过仅允许单独的处理器简单,经济有效的升级来扩展子系统的使用寿命。这减少了所有权的长期成本,同时确保性能的不断变化的需求的步伐。
Offered with a choice of either a dual-core or quad-core processor for maximum flexibility and enabling customers to select the optimum price-performance/watt combination for the planned application, the bCOM6-L1400 takes advantage of GE’s extensive experience and expertise in the design and development of rugged COM Express modules. It also complements GE Intelligent Platforms’ extensive portfolio ofrugged embedded computing solutions that includes single board computers, multiprocessors, Ethernet switches, displays and networking.
BCOM6-L1400可以自信地部署在最恶劣,最具挑战性环境中,这些环境受到极端温度,振动,休克和污染物。其组件专门用于敌对环境中可靠的操作,并且处理器和存储器焊接到电路板上,以获得对外力的最高抵抗力。
扩展机械结构保护模块,该模块专为可选的保形涂层而设计,甚至更大的耐水性,灰尘,化学品和极端温度。复杂的动态热管理优化正常运行时间,有助于防止损坏系统。
GE能够为客户提供必要的支持,使其能够开发自己的运营商卡配置,或根据要求提供自定义运营商卡变体。这种能力为寻求创建独特的高附加值的解决方案的系统集成商提供了显着的灵活性。
“The bCOM6-L1400 is a further example of GE’s rugged high performance platform strategy in action, and of our commitment to bringing the most recent processor technologies to market as rapidly as possible,” said Steve Pavlovsky, Product General Manager, Control & Communication Systems, GE Intelligent Platforms. “The COM Express architecture is ideal for OEMs looking to reduce developments costs, minimize risk and time to market and to provide the lowest possible cost of ownership. With the announcement of GE’s bCOM6-L1400, those customers get not just the benefits of COM Express and of Intel’s latest processor, but also outstanding performance, exceptional flexibility, remarkable robustness – and the commitment to customer satisfaction for which GE is renowned.”
除了其图形功能(VGA,带有双通道支持的LVDS和DDI的SDVO / TMDS / DisplayPort),BCOM6-L1400功能最多可达8GBytes的DDR3内存,千兆以太网和四个SATA接口,支持所有RAID 0和RAID 1.还提供了最佳连接提供了八个USB 2.0端口和四个USB 3.0端口。
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