Molex和Samtec宣布了许可的源协议，汇集了新一代解决方案的创新，以满足56克和112G数据速度的不断变化的需求。
Molex和Samtec是唯一一个许可的供应商，提供Molex Bipass和Samtec Twinax天桥系统，以满足随着数据中心随着超越型号的发展和增加虚拟化所需的高速应用程序所需的越来越多的高速应用需求。许可源协议的范围包括下一代高速电缆，电缆组件和连接器，旨在为客户提供两个源，以实现完整的优化通道，可以允许盒子内外更广泛的Twinax技术基础。
随着带宽要求迅速增加，通过有损PCB，VIA和其他组件的路由信号已成为设计师面临的最复杂的挑战之一。Molex和Samtec协作旨在带来具有先进特征的电气和机械解决方案，可提高信号完整性，更长的达到，EMI遏制和热效。
“Molex is excited to be collaborating with Samtec on this industry challenge,” said Brian Hauge, vice president and general manager of the copper solutions business unit, Molex. “Molex and Samtec have a rich history of delivering unique connectivity solutions to the market. Through this collaboration, we expect these core technology building blocks will enable the industry with a viable platform supporting 112Gbps+ channels.”
“The constant demand for faster data rates in data center equipment, HPC and other applications require the most advanced technologies. The agreement provides the means for Samtec and Molex to offer architecture flexibility and future innovations across the industry,” said Brian Vicich, vice president of engineering, Samtec.
For more information on Samtec Twinax Flyover Systems, please visitwww.samtec.com/flyover。For more information on the Molex BiPass system, please visitwww.molex.com/bipassassemblies。
Molex
www.molex.com
Samtec Inc.
www.samtec.com
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