TE连接(TE)也推出了其ELCON显微镜o power connectors, which deliver high current density in a commonly used industry footprint of 3.0 mm. The new connectors provide 12.5 A per pin, making them useful for servers, switches, storage devices and testing machines.
By using a common industry footprint, TE’s ELCON Micro power connectors allow for easy upgrades to existing designs. The 3.0-mm printed circuit board (PCB) footprint is compatible with Molex’s Micro-Fit headers and BellWether’s Micro-Hi headers. These new connectors support 2 to 24 pin configurations and perform reliably in harsh environments due to their maximum operating temperature of 105° C and their halogen-free material. Additionally, the connector housing is designed to prevent mismating, making assembly easier for users.
“High power and reliable connectivity in an easy-to-use form factor are the key features of our new ELCON Micro power connectors,” said Henry Xie, power product manager at TE Connectivity. “With a working voltage of 600 V and the ability to support different currents with multiple combinations of different wire sizes, these connectors offer the flexibility and performance to make them standouts in the power connector market.”
TE Connectivity Ltd.
www.te.com
Filed Under:Connectors (electrical) • crimp technologies
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