In addition to radar, LiDAR and camera sensing used in 3D obstacle detection and collision avoidance in advanced driver assistance systems (ADAS) in vehicles, ultrasonic sensing has been used as well. Traditionally, the ultrasonic sensors used transducer-based technology to provide a microphone to transmit and receive the ultrasonic signal in passenger vehicle parking applications. Using Infineon’s XENSIV™IM73A135V01microelectromechanical systems (MEMS) microphone and Toposens proprietary 3D ultrasound technology, Toposens next-generationECHO ONE DKultrasonic sensor targets automated guided vehicle (AGV), robot or other applications to avoid collisions with many different types of obstacles. Toposens created its system using real-time 3D data mapping and object recognition software to guide autonomous systems in the most difficult environments.
Low cost and energy efficient compared to existing industrial 3D sensors, the IM73A135V01 MEMS microphone’s superior performance and small form factor enable better ultrasonic 3D sensor systems resulting in the best range and widest opening angle. The performance results from the combination of exceptionally low noise and the highest signal-to-noise ratio (SNR) in the industry, resulting in improved reliability of the 3D data. This allows the detection of very faint ultrasonic echoes from distant, complex and small objects.
在障碍物检测应用中，与现有的传感器技术不同，在照明条件，反射和天气通常会影响其性能的情况下，拓孔传感器依赖于eCholocation来生成实时3D点云。经运行范围从200毫米，帧速率约为20 Hz，开口角度高达180°，回声一点DK可以在非常具有挑战性的条件下引导自主系统。通过低校准工作和高可靠性和鲁棒性实现，实现支持避免碰撞避免关键的呼应器。此外，超声波传感系统减少了能够降低系统效率的光学传感器可能发生的大量误报和误报。
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