Hirose has expanded its miniature BM23 series FPC-to-board connector to include a standard signal only version and a hybrid connector version that provides both signal and power contacts. Designed for portable electronic devices that require high transmission speeds and rugged performance, the BM23 series connector features a miniature design that offers significant space-savings in digital cameras, portable audio players, portable gaming devices, laptops, smartphones, tablets, wearable devices, and more.
The BM23PF series hybrid connector features signal contacts rated to 0.3 A and power contacts rated to 5 A. The BM23PF version is available in one stack height of 0.8 mm with 10, 14, 20, 24, 30, 40, 42, 46, and 54 contact options.
The standard signal only BM23FR version is rated to 0.3 A. The BM23FR is available in 2 stack heights including 0.6 and 0.8 mm. The 0.8 mm stack height is available in 10, 18, and 60 contacts. The 0.6 mm stack height is available in 6, 8, 10, 12, 16, 20, 24, 30, 30, 40, and 50 contacts.
Both the BM23PF and BM23FR versions support USB 3.1 gen.2 and provide transmission speeds up to 10 Gbps. With a pitch of only 0.35 mm, depth of 1.98 mm, and fast transmission speeds, the low-profile BM23 series FPC-to-board connector offers unique design flexibility and further enables the miniaturization of portable devices.
The connector has a robust design with metal solder retention tabs that provide strong PCB retention by absorbing and reducing stress caused by drop impacts. This metal tab also prevents housing damage if the connector is mis-mated and helps to deliver a breaking strength of 90 N, which is up to three times more than other products on the market. A rugged metal lock provides a clear tactile click preventing any unintentional disconnect.
The BM23 series FPC-to-board connector has a highly reliable two-point “U” shaped contact design where the receptacle contact encloses the entire header contact to ensure stable and repeatable performance. Offering simple and easy mating operation, the BM23 series uses guide ribs that provide self-alignment up to 0.4 mm in the pitch direction and 0.3 mm in the width direction.
“The compact BM23 series hybrid connector is designed for portable electronic devices that are susceptible to high vibration and drop impacts,” said Bill Kysiak, Product Marketing Manager for Hirose Electric USA. “The space-saving connector supports next-generation transmission speeds while reducing the occupied mounting area in comparison with comparable connectors on the market. This allows OEMs to reduce the size of their portable electronic devices.”
The BM23 series connector has a rated voltage of 30 Vac/dc, rated current of 0.3 A, contact resistance of 100 milliohm maximum, insulation resistance of 50 Megaohm minimum, and an operating temperature of –55° to 85° C.
Hirose Electric
www.hirose.com
Filed Under:Connectors (electrical) • crimp technologies
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