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TE Connectivity debuts high density power card edge solution for data centers

ByMary Gannon|January 29, 2018

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TE Connectivity (TE) has released its high density (HD) card edge power connector, which delivers among the highest current density in the market to support high power supply applications.

TE-Connectivity-Power-Edge-Card TE’s new HD card edge connector delivers higher current than previous power card edge connectors at 25 A/contact with low resistance, and supports 1,500-2,000 W power supplies for data center equipment. With a maximum operating temperature of 130° C, the connector provides reliable performance in harsh environments. In addition, the signal pitch is 1.27 mm (compatible with common industry PCB footprint designs), and the elasticity of the power/signal pins provides low mating force.

“电流密度和功率要求服务器, switches and storage devices are increasing, and the industry demands solutions that can meet those needs in demanding environments,” said Bandy Yuan, product manager at TE Connectivity. “TE’s HD card edge connector is a solution that addresses the requirements of networking device manufacturers for next generation equipment.”

TE Connectivity Ltd.
www.te.com


Filed Under:Connectors (electrical) • crimp technologies
Tagged With:TEConnectivity,te

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